Tuesday, July 14, 2026

DF1000: Today China is already moving into 3D AI chip architecture

The DF1000, developed by Shanghai Orient Computing Core Technology Co., Ltd, is a software-defined, near-memory computing 3D AI chip designed to deliver high computing performance for AI applications.

One of the chip's key technologies is its software-defined architecture, which combines spatial parallelism in task processing with time-division multiplexing of hardware resources to improve hardware utilization while reducing dependence on advanced semiconductor manufacturing processes.
  • The company said the DF1000 is capable of delivering computing performance of up to 520 TFLOPS in BF16 precision.
  • China is using 3D chip architectures as part of a major strategic effort to sidestep the export bans that keep them from getting the equipment needed to make sub 7 nanometer chips.
  • The Shanghai-based firm plans to launch the next-generation DF2000 in the fourth quarter of 2026, followed by the DF3000 in the fourth quarter 2027
Uploaded: Jul 14, 2026
Shanghai on Monday unveiled a high-performance 3D artificial intelligence (AI) chip 



China unveils world's first high-compute 3D AI chip Yesterday the narrative  was: China is stuck in 2D. Today China is already moving into 3D AI chip  architecture. That's the point of Chinese

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